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The themes Taiwan Semiconductor Manufacturing is part of, the highest-graded companies in its industry, and the companies in its sector whose grade rose recently.
Highest-graded in Semiconductors
Graded A or B and worth $2B or more: A first, then the largest.
NVDANVIDIA Corp.US$4.19TA+
AVGOBroadcom Inc.US$1.65TA+
MUMicron Technology, Inc.US$918.5BA+
AMDAdvanced Micro Devices, Inc.US$906.7BA+
TXNTexas Instruments Inc.US$283.2BA+
Grade rose recently in Technology
Rose to A or B on a filing in the last 90 days, worth $2B or more: largest first.
LRCXLAM Research Corporation2026年10月22日BAGraded B, now A
IBMInternational Business Machines Corporation2026年10月21日BAGraded B, now A
CDNSCadence Design Systems, Inc.2026年10月28日BAGraded B, now A
NXPINXP Semiconductors N.V.2026年10月27日BAGraded B, now A
UIUbiquiti Inc.2026年11月6日BAGraded B, now A
怎么赚钱
- Manufacturing chips to customers' designs, with related design, mask-making, packaging and testing services
竞争对手
- SSNLFSamsung Foundry (Samsung Electronics)
- INTCIntel Foundry (Intel Corporation)B
- 规模
- US$332.2B
- 利润率
- -20.1%
- GFSGlobalFoundriesC
- 规模
- US$23.8B
- 利润率
- 2.8%
- UMCUnited Microelectronics CorporationC
- 规模
- US$40.5B
- 利润率
- 17.0%
卖什么5
Wafer fabrication
Manufacturing chips on silicon wafers using customers' circuit designs. Processes include logic chips, radio-frequency chips and chips that combine logic with memory.
Chip design and process support
Design tools, tested building blocks and technical guidance that help customers prepare their chip designs for manufacturing.
Mask making
Making the patterned templates used to transfer a chip design onto a silicon wafer.
再显示 2 项
Advanced chip packaging
Combining chips, including stacking chips or placing them side by side, into a package. TSMC's methods include Chip-on-Wafer-on-Substrate (CoWoS), Integrated Fan-Out (InFO) and System on Integrated Chips (SoIC).
Chip testing
Testing manufactured chips to check their operation.
谁在买3
- Fabless chip companies that design chips but hire other companies to manufacture them; TSMC works directly with them on designs, production and delivery.
- Technology and system companies that design chips for products such as data-center equipment, phones and consumer electronics.
- Integrated device manufacturers that design and manufacture chips and use TSMC for some production.
靠什么支撑，什么会击垮它
业务依赖什么
- 1Chip production depends on specialized manufacturing equipment, some of which is available from only a limited number of suppliers.
- 2Silicon wafers and other materials are essential inputs; most wafer supplies come from a limited number of suppliers, and some materials have sole-source suppliers.
- 3Factories in Taiwan need reliable electricity and large amounts of water; shortages or interruptions can disrupt production.
- 4Revenue depends on customer demand for chips and on customers' product plans; a small number of large customers can account for a significant portion of revenue.
可能出什么问题
- 1The semiconductor industry is cyclical: weaker demand or lower prices for products containing chips can reduce orders and factory use.
- 2If TSMC cannot develop new manufacturing processes in time or compete with other chip manufacturers, customers may choose other suppliers and its production capacity may lose value.
- 3Power or water shortages, utility outages, or natural disasters could interrupt production at factories, particularly in Taiwan.
关于Taiwan Semiconductor Manufacturing Co. Ltd.
Chip companies give TSMC their circuit designs, and TSMC manufactures the chips on silicon wafers. It also helps with chip design and masks, tests chips, and packages multiple chips together. In Q2 2026, high-performance computing accounted for 66% (Q2 2026, high confidence) of revenue and smartphones for 22% (Q2 2026, high confidence); the remaining reported categories were internet of things at 5% (Q2 2026, high confidence), automotive at 4% (Q2 2026, high confidence), and digital consumer electronics at 1% (Q2 2026, high confidence).
- 总部
- Hsinchu, Taiwan
- 成立于
- 1987
- 上市于
- NYSE
- 财年结束
- December 31
基于 Taiwan Semiconductor Manufacturing Co. Ltd. 自己向美国证券交易委员会（SEC）提交的申报文件。数字如实呈报，每股历史已重述到今天的股数口径。 该公司以 TWD 申报。数字按当前汇率 US$1.00 = 32.9866 TWD 换算为美元，并对所有期间一视同仁——因此增长和利润率属于公司本身，而不是汇率。 这是对一门生意的描述——不是投资建议，也不是买卖任何证券的推荐。