Wafer fabrication
Manufacturing chips on silicon wafers using customers' circuit designs. Processes include logic chips, radio-frequency chips and chips that combine logic with memory.
Chip design and process support
Design tools, tested building blocks and technical guidance that help customers prepare their chip designs for manufacturing.
Mask making
Making the patterned templates used to transfer a chip design onto a silicon wafer.
Advanced chip packaging
Combining chips, including stacking chips or placing them side by side, into a package. TSMC's methods include Chip-on-Wafer-on-Substrate (CoWoS), Integrated Fan-Out (InFO) and System on Integrated Chips (SoIC).
Chip testing
Testing manufactured chips to check their operation.
Chip companies give TSMC their circuit designs, and TSMC manufactures the chips on silicon wafers. It also helps with chip design and masks, tests chips, and packages multiple chips together. In Q2 2026, high-performance computing accounted for 66% (Q2 2026, high confidence) of revenue and smartphones for 22% (Q2 2026, high confidence); the remaining reported categories were internet of things at 5% (Q2 2026, high confidence), automotive at 4% (Q2 2026, high confidence), and digital consumer electronics at 1% (Q2 2026, high confidence).
Built from Taiwan Semiconductor Manufacturing Co. Ltd.’s own filings with the U.S. Securities and Exchange Commission (SEC). Figures are as reported, with per-share history restated onto today’s share basis. This company files in TWD. Figures are converted to US dollars at $1.00 = 32.9866 TWD, the current rate, applied to every period alike — so growth and margins are the company’s own and not the exchange rate’s. This describes a business — it is not investment advice and not a recommendation to buy or sell anything.
The themes Taiwan Semiconductor Manufacturing is part of, the highest-graded companies in its industry, and the companies in its sector whose grade rose recently.
Graded A or B and worth $2B or more: A first, then the largest.
Rose to A or B on a filing in the last 90 days, worth $2B or more: largest first.
TSM · NYSE · Technology · Semiconductors
$413.28+4.2%Nov 11 close
Figures through September 30, 2026, from the 6-K filed October 15, 2026
TSMC manufactures custom silicon chips for chip designers and technology companies, and packages them for use in phones, data centers, cars and other electronics.
Grade B+
The band under the price shows the grade on each date, built only from filings that were public by then.
Showing 2 of 14 quarters of Taiwan Semiconductor Manufacturing Co. Ltd.’s grade history. The other 12 go back to April 2018.